Tbogg-Sensor-Package-PCB

The sensor package (strain, temperature, vibration) for the 2024 UofC GNCTR tbogg. Designed as an R&D intrastructure monitoring solution.

Main Components

1. 2x Strain Gauge Blocks
   • Ulimately reads one of these two strain gauges:
     1. 100x BF350-3AA
     2. 10x BX120-2AA
   • Based on this schematic
   • Sensing via HX711 chip
2. 1x On-PCB Temperature Sensor (STDS75DS2F)
   • I2C
3. 2x In-Concrete Temperature Sensors
   • Thermistor-based
4. 1x Vibration Sensor
   • Model: MPU-6050 Breakout
   • I2C Comms
5. I2C Optical Flow Sensor
6. Battery: 4x 18650
   • TODO: choose quantity, model, holder, and connection
   • In series
7. Battery Management System: probably the 3V3 buck-boost from the balloon project
   • TODO: more info
8. Wireless Comms: LoRa Wio E5
   • TODO: pull from balloon project
   • TODO: confirm that this model is good
9. Microcontroller Unit (MCU)
   • ESP32 Breakout

Reference Links

• TODO: fill

Revision Notes

• PCB orders will each recieve a new revision number.
  • PCB orders will be in the format of "Rev1", "Rev2", etc.
  • GitHub Releases (and Tags) will be tagged in the format of rev1, rev2, etc.
• BOM changes on PCB orders should be documented as minor revisions.
  • Example: rev1.1, rev1.2, etc.